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DMN2400UV
Maximum Ratings @T A = 25°C unless otherwise specified
Drain-Source Voltage
Gate-Source Voltage
Characteristic
Symbol
V DSS
V GSS
Value
20
±12
Units
V
V
Continuous Drain Current (Note 4)
Pulsed Drain Current
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
I DM
1.33
0.84
3
A
A
Thermal Characteristics
@T A = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
P D
R θ JA
T J, T STG
Value
530
233.8
-55 to +150
Units
mW
°C/W
°C
Electrical Characteristics @T A = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current T J = 25°C
Gate-Source Leakage
BV DSS
I DSS
I GSS
20
-
-
-
-
-
-
-
-
100
±1.0
±50
V
nA
μ A
V GS = 0V, I D = 250 μ A
V DS = 20V, V GS = 0V
V GS = ±4.5V, V DS = 0V
V GS = ±10V, V DS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V GS(th)
0.5
-
0.9
V
V DS = V GS , I D = 250 μ A
-
-
0.3
0.35
0.48
0.5
V GS = 5.0V, I D = 200mA
V GS = 4.5V, I D = 600mA
Static Drain-Source On-Resistance
R DS (ON)
-
0.45
0.7
Ω
V GS = 2.5V, I D = 500mA
-
-
0.55
0.65
0.9
1.5
V GS = 1.8V, I D = 350mA
V GS = 1.5V, I D = 50mA
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
|Y fs |
V SD
-
1.4
0.7
-
1.2
S
V
V DS = 10V, I D = 400mA
V GS = 0V, I S = 150mA,
f = 1.0MHz
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
C iss
C oss
C rss
R g
Q g
Q gs
Q gd
t D(on)
t r
t D(off)
t f
-
-
-
-
-
-
-
-
-
-
-
36.0
5.7
4.2
68
0.5
0.07
0.1
4.06
7.28
13.74
10.54
-
-
-
-
-
-
-
-
-
-
-
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V DS =16V, V GS = 0V,
f = 1.0MHz
V DS = 0V, V GS = 0V,
V GS =4.5V, V DS = 10V,
I D =250mA
V DD = 10V, V GS = 4.5V,
R L = 47 ? , R G = 10 ? ,
I D = 200mA
Notes:
4. Device soldered onto FR-4 PCB, minimum recommended soldering pad dimensions (25.4mm x 25.4mm x1.6mm, 2oz Cu pad: 0.18mm 2 x 6).
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.
DMN2400UV
Document number: DS31852 Rev. 7 - 2
2 of 6
www.diodes.com
January 2011
? Diodes Incorporated
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